1. 高速低功耗二维材料光电集成芯片 2025-2027 课题负责人在研
2. 超表面异质集成二维材料红外光电成像芯片 2025-2028 项目骨干在研
3. 片上集成可调谐光源关键材料与器件基础 2024-2026 课题负责人在研
4. 高迁移率超薄半导体材料与高性能器件集成 2022-2027 课题骨干在研
5. 连续体束缚态电介质超表面的高效设计和计算传感方法研究 2024-2027主持在研
6. 柔性微纳结构与传感器件 2021-2023 主持结题
7. 柔性等离激元彩色显示的高效逆向设计和制备 2020-2023主持结题
8. 面向柔性彩色显示的镁等离激元器件研究 2019-2022 主持结题
9. 柔性等离激元对二维层状半导体光电性能的调控研究 2017-2019 主持结题
10. 可延展石墨烯的结构设计与器件制备基础研究 2016-2018 主持结题
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